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Min 3 Mil 0.1mm Hole High Density Interconnector Pcb For Industrial Control

    Buy cheap Min 3 Mil 0.1mm Hole High Density Interconnector Pcb For Industrial Control from wholesalers
     
    Buy cheap Min 3 Mil 0.1mm Hole High Density Interconnector Pcb For Industrial Control from wholesalers
    • Buy cheap Min 3 Mil 0.1mm Hole High Density Interconnector Pcb For Industrial Control from wholesalers
    • Buy cheap Min 3 Mil 0.1mm Hole High Density Interconnector Pcb For Industrial Control from wholesalers

    Min 3 Mil 0.1mm Hole High Density Interconnector Pcb For Industrial Control

    Ask Lasest Price
    Brand Name : HNL-PCBA
    Model Number : PCB Assembly 012
    Certification : ISO9001,IS16949, ISO14001,ROHS , UL, IPC-A , UL, QC080000
    Price : Negotiable
    Payment Terms : T/T, Western Union, L/C, MoneyGram
    Supply Ability : 10,000,000 Point /Day
    Delivery Time : 1-7days
    • Product Details
    • Company Profile

    Min 3 Mil 0.1mm Hole High Density Interconnector Pcb For Industrial Control

    Min 3mil 0.1mm Hole High Density Interconnector PCB For Industrial Control

    HDI PCB Board Introduction


    Our products include: high-precision double-sided PCB circuit boards, PCB multilayer circuit boards, HDI circuit boards, PCB high-frequency boards, ceramic circuit boards and other special and difficult circuit boards, focusing on multi-variety, small and medium-sized batches.

    PCB circuit boards are widely used in communications, industrial control, computer applications, aerospace, military, medical, testing equipment and other fields.


    HDI is the abbreviation of High Density Interconnector, which is a (technology) for the production of printed circuit boards. HDI is a compact product designed for small volume users.


    Advantages of HDI circuit
    1. It can reduce the cost of PCB: when the density of the PCB increases beyond the eight-layer board, it is manufactured with HDI, and the cost will be lower than the traditional complex lamination process.
    2. Increase line density: interconnection of traditional circuit boards and parts
    3. Conducive to the use of advanced construction technology
    4. Has better electrical performance and signal accuracy
    5. Better reliability
    6. Can improve thermal properties
    7. Can improve radio frequency interference/electromagnetic wave interference/electrostatic discharge (RFI/EMI/ESD)
    8. Increase design efficiency


    PCB CAPABILITIES

    FACTORY CAPABILITIES
    No.Items20192020
    1HDI CapabilitiesHDI ELIC (4+2+4)HDI ELIC(5+2+5)
    2Max layer count32L36L
    3Board ThicknessCore thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mmCore thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm
    4Min.Hole SizeLaser 0.075mmLaser 0.05mm
    Mechnical 0.15mmMechnical 0.15mm
    5Min Line Width/Space0.035mm/0.035mm0.030mm/0.030mm
    6Copper Thickness1/3oz-4oz1/3oz-6oz
    7Size Max Panel size700x610mm700x610mm
    8Registration Accuracy+/-0.05mm+/-0.05mm
    9Routing Accuracy+/-0.075mm+/-0.05mm
    10Min.BGA PAD0.15mm0.125mm
    11Max Aspect Ratio10:110:1
    12Bow and Twist0.50%0.50%
    13Impedance Control Tolerance+/-8%+/-5%
    14Daily Output3,000m2 (Max capacity of equipment)4,000m2 (Max capacity of equipment)
    15Surface FinishingENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD
    16Raw MaterialFR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI

    The types of HDI PCB


    1.through vias from surface to surface,
    2.with buried vias and through vias,
    3.two or more HDI layer with through vias,
    4.passive substrate with no electrical connection,
    5.coreless construction using layer pairs
    6.alternate constructions of coreless constructions using layer pairs.


    HDI (High Density Interconnection) circuit boards usually include laser blind vias and mechanical blind vias; general through buried vias, blind vias, stacked vias, staggered vias, cross blind buried, through vias, blind via filling plating, fine line small gaps, The technology of realizing the conduction between the inner and outer layers by processes such as micro-holes in the disk, usually the diameter of the blind buried is not more than 6 mils.


    Min 3 Mil 0.1mm Hole High Density Interconnector Pcb For Industrial Control

    Work flow for HDI


    Board Cut - Inner Wet film -DES - AOI - Brown Oxido - Outer Layer Press - Out Layer Lamination - X-RAY & Rounting - Copper reduce & brown oxide - Laser Drilling - Drilling - Desmear PTH - Panel plating - Outer Layer dry film - Etching - AOI- Impedance Testing - S/M Pluged hole - Solder Mask - Component Mark - Impedance testing - Immersion Gold -V-cut - Routing - Electrical Test - FQC - FQA -Package -Shipment


    Min 3 Mil 0.1mm Hole High Density Interconnector Pcb For Industrial Control


    Similar products


    Min 3 Mil 0.1mm Hole High Density Interconnector Pcb For Industrial Control


    HDI PCB Board Application Field


    Our PCB are widely used in mobile phones, digital (camera) cameras, notebook computers, automotive electronics and other digital products, communication equipment, industrial control, consumer electronics, medical equipment, aerospace, light-emitting diode lighting, automotive electronics etc.


    Workshop


    Min 3 Mil 0.1mm Hole High Density Interconnector Pcb For Industrial Control


    Min 3 Mil 0.1mm Hole High Density Interconnector Pcb For Industrial Control


    Common packaging


    1.PCB: Vacuum packaging with carton box
    2.PCBA: ESD packaging with carton box



    Our advantage


    1.Service value

    Independent quotation system to quickly serve the market

    2.PCB manufacturing

    High-tech PCB and PCB assembly production line

    3.Material purchasing

    A team of experienced electronic component procurement engineers

    4.SMT post soldering

    Dust-free workshop, high-end SMT patch processing


    FAQ


    Q1:What kind of PCB file format can you accept for production?
    Gerber, PROTEL 99SE, PROTEL DXP, CAM350, ODB+(.TGZ)

    Q2:Is my PCB files safe when I submit them to you for manufacturing?

    We respect customer's copyright and will never manufacture PCB for someone else with your files unless we receive written permission from you, nor we'll share these files with any other 3rd parties.

    Q3:What payments do you accept ?
    -Telex Transfer(T/T),Western Union,Letter of Credit(L/C)
    -Paypal,AliPay,Credit Card

    Q4:How to get the PCB?
    A:For small packages, we will ship the boards to you by DHL,UPS,FedEx,EMS. Door to door service! You will get your PCBs at your home.
    B:For heavy goods more than 300kg, we may ship your boards by ship or by air to save freight cost. Of course, if you have your own forwarder, we may contact them for dealing with your shipment.

    Q5:What is your minimum order quantity?
    Our MOQ is 1 PCS.

    Q6: Can we visit your company?

    No problem. You are welcome to visit us in Beijing. Or the branch factory is in Tianjin.

    Q7: How can you ensure the quality of the PCB?
    Our PCBs are 100% test including Flying Probe Test, E-test and AOI.


    Min 3 Mil 0.1mm Hole High Density Interconnector Pcb For Industrial Control

    Quality Min 3 Mil 0.1mm Hole High Density Interconnector Pcb For Industrial Control for sale
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