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Green High End Hdi Pcb Board For Automotive Electronics

    Buy cheap Green High End Hdi Pcb Board For Automotive Electronics from wholesalers
     
    Buy cheap Green High End Hdi Pcb Board For Automotive Electronics from wholesalers
    • Buy cheap Green High End Hdi Pcb Board For Automotive Electronics from wholesalers
    • Buy cheap Green High End Hdi Pcb Board For Automotive Electronics from wholesalers

    Green High End Hdi Pcb Board For Automotive Electronics

    Ask Lasest Price
    Brand Name : HNL-PCBA
    Model Number : PCB Assembly 012
    Certification : ISO9001,IS16949, ISO14001,ROHS , UL, IPC-A , UL, QC080000
    Price : Negotiable
    Payment Terms : T/T, Western Union, L/C, MoneyGram
    Supply Ability : 10,000,000 Point /Day
    Delivery Time : 1-7days
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    Green High End Hdi Pcb Board For Automotive Electronics

    Green High-End HDI Printed Circuit Board For Automotive Electronics

    HDI PCB Board Introduction

    HDI is the abbreviation of High Density Interconnector, which is a (technology) for the production of printed circuit boards. HDI is a compact product designed for small volume users.


    High Density Integration (HDI) technology enables more miniaturization of end product designs while meeting higher standards for electronic performance and efficiency. HDI is widely used in mobile phones, digital (camera) cameras, notebook computers, automotive electronics and other digital products, among which mobile phones are the most widely used. HDI boards are generally manufactured by the build-up method. Ordinary HDI boards are basically one-time buildup, and high-end HDI uses two or more buildup technologies, while using advanced PCB technologies such as stacking, electroplating, and laser direct drilling. High-end HDI boards are mainly used in mobile phones, advanced digital cameras, IC substrates, etc.


    Advantages of HDI circuit
    1. It can reduce the cost of PCB: when the density of the PCB increases beyond the eight-layer board, it is manufactured with HDI, and the cost will be lower than the traditional complex lamination process.
    2. Increase line density: interconnection of traditional circuit boards and parts
    3. Conducive to the use of advanced construction technology
    4. Has better electrical performance and signal accuracy
    5. Better reliability
    6. Can improve thermal properties
    7. Can improve radio frequency interference/electromagnetic wave interference/electrostatic discharge (RFI/EMI/ESD)
    8. Increase design efficiency


    PCB CAPABILITIES

    FACTORY CAPABILITIES
    No.Items20192020
    1HDI CapabilitiesHDI ELIC (4+2+4)HDI ELIC(5+2+5)
    2Max layer count32L36L
    3Board ThicknessCore thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mmCore thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm
    4Min.Hole SizeLaser 0.075mmLaser 0.05mm
    Mechnical 0.15mmMechnical 0.15mm
    5Min Line Width/Space0.035mm/0.035mm0.030mm/0.030mm
    6Copper Thickness1/3oz-4oz1/3oz-6oz
    7Size Max Panel size700x610mm700x610mm
    8Registration Accuracy+/-0.05mm+/-0.05mm
    9Routing Accuracy+/-0.075mm+/-0.05mm
    10Min.BGA PAD0.15mm0.125mm
    11Max Aspect Ratio10:110:1
    12Bow and Twist0.50%0.50%
    13Impedance Control Tolerance+/-8%+/-5%
    14Daily Output3,000m2 (Max capacity of equipment)4,000m2 (Max capacity of equipment)
    15Surface FinishingENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD
    16Raw MaterialFR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI

    The types of HDI PCB


    1.through vias from surface to surface,
    2.with buried vias and through vias,
    3.two or more HDI layer with through vias,
    4.passive substrate with no electrical connection,
    5.coreless construction using layer pairs
    6.alternate constructions of coreless constructions using layer pairs.


    HDI (High Density Interconnection) circuit boards usually include laser blind vias and mechanical blind vias; general through buried vias, blind vias, stacked vias, staggered vias, cross blind buried, through vias, blind via filling plating, fine line small gaps, The technology of realizing the conduction between the inner and outer layers by processes such as micro-holes in the disk, usually the diameter of the blind buried is not more than 6 mils.


    Green High End Hdi Pcb Board For Automotive Electronics

    Work flow for HDI


    Board Cut - Inner Wet film -DES - AOI - Brown Oxido - Outer Layer Press - Out Layer Lamination - X-RAY & Rounting - Copper reduce & brown oxide - Laser Drilling - Drilling - Desmear PTH - Panel plating - Outer Layer dry film - Etching - AOI- Impedance Testing - S/M Pluged hole - Solder Mask - Component Mark - Impedance testing - Immersion Gold -V-cut - Routing - Electrical Test - FQC - FQA -Package -Shipment


    Green High End Hdi Pcb Board For Automotive Electronics


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    Green High End Hdi Pcb Board For Automotive Electronics


    HDI PCB Board Application Field


    Our PCB are widely used in mobile phones, digital (camera) cameras, notebook computers, automotive electronics and other digital products, communication equipment, industrial control, consumer electronics, medical equipment, aerospace, light-emitting diode lighting, automotive electronics etc.


    Workshop


    Green High End Hdi Pcb Board For Automotive Electronics


    Green High End Hdi Pcb Board For Automotive Electronics


    Common packaging


    1.PCB: Vacuum packaging with carton box
    2.PCBA: ESD packaging with carton box



    Our advantage


    1.Service value

    Independent quotation system to quickly serve the market

    2.PCB manufacturing

    High-tech PCB and PCB assembly production line

    3.Material purchasing

    A team of experienced electronic component procurement engineers

    4.SMT post soldering

    Dust-free workshop, high-end SMT patch processing


    Green High End Hdi Pcb Board For Automotive Electronics

    Quality Green High End Hdi Pcb Board For Automotive Electronics for sale
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