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Buried Vias Enig Oem Pcb Board Multi-Layering 1oz Hdi

    Buy cheap Buried Vias Enig Oem Pcb Board Multi-Layering 1oz Hdi from wholesalers
     
    Buy cheap Buried Vias Enig Oem Pcb Board Multi-Layering 1oz Hdi from wholesalers
    • Buy cheap Buried Vias Enig Oem Pcb Board Multi-Layering 1oz Hdi from wholesalers
    • Buy cheap Buried Vias Enig Oem Pcb Board Multi-Layering 1oz Hdi from wholesalers

    Buried Vias Enig Oem Pcb Board Multi-Layering 1oz Hdi

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    Brand Name : HNL-PCBA
    Model Number : PCB Assembly 012
    Certification : ISO9001,IS16949, ISO14001,ROHS , UL, IPC-A , UL, QC080000
    Price : Negotiable
    Payment Terms : T/T, Western Union, L/C, MoneyGram
    Supply Ability : 10,000,000 Point /Day
    Delivery Time : 1-7days
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    Buried Vias Enig Oem Pcb Board Multi-Layering 1oz Hdi

    ENIG Multi-Layering 1oz HDI Printed Circuit Board

    HDI PCB Board Introduction

    High Density Interconnection (HDI) PCB is a kind of (technology) for the production of printed circuit boards. It is a circuit board with relatively high circuit distribution density using micro blind via and buried via technology. Due to the continuous development of technology and the electrical requirements for high-speed signals, the circuit board must provide impedance control with AC characteristics, high-frequency transmission capability, and reduce unnecessary radiation (EMI). Adopting the structure of Stripline and Microstrip, multi-layering becomes a necessary design. In order to reduce the quality problem of signal transmission, insulating materials with low dielectric constant and low attenuation rate are used. In order to meet the miniaturization and arraying of electronic components, the density of circuit boards is constantly increasing to meet the demand.


    PCB (Printed circuit board) is the most import role in the Electronic time, the electronic products which we can think of will need the PCB board, We are manufacture with year's experience in PCB & PCBA solutions .


    PCB CAPABILITIES

    FACTORY CAPABILITIES
    No.Items20192020
    1HDI CapabilitiesHDI ELIC (4+2+4)HDI ELIC(5+2+5)
    2Max layer count32L36L
    3Board ThicknessCore thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mmCore thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm
    4Min.Hole SizeLaser 0.075mmLaser 0.05mm
    Mechnical 0.15mmMechnical 0.15mm
    5Min Line Width/Space0.035mm/0.035mm0.030mm/0.030mm
    6Copper Thickness1/3oz-4oz1/3oz-6oz
    7Size Max Panel size700x610mm700x610mm
    8Registration Accuracy+/-0.05mm+/-0.05mm
    9Routing Accuracy+/-0.075mm+/-0.05mm
    10Min.BGA PAD0.15mm0.125mm
    11Max Aspect Ratio10:110:1
    12Bow and Twist0.50%0.50%
    13Impedance Control Tolerance+/-8%+/-5%
    14Daily Output3,000m2 (Max capacity of equipment)4,000m2 (Max capacity of equipment)
    15Surface FinishingENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD
    16Raw MaterialFR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI

    The types of HDI PCB


    1.through vias from surface to surface,
    2.with buried vias and through vias,
    3.two or more HDI layer with through vias,
    4.passive substrate with no electrical connection,
    5.coreless construction using layer pairs
    6.alternate constructions of coreless constructions using layer pairs.


    HDI (High Density Interconnection) circuit boards usually include laser blind vias and mechanical blind vias; general through buried vias, blind vias, stacked vias, staggered vias, cross blind buried, through vias, blind via filling plating, fine line small gaps, The technology of realizing the conduction between the inner and outer layers by processes such as micro-holes in the disk, usually the diameter of the blind buried is not more than 6 mils.


    Buried Vias Enig Oem Pcb Board Multi-Layering 1oz Hdi

    Work flow for HDI


    Board Cut - Inner Wet film -DES - AOI - Brown Oxido - Outer Layer Press - Out Layer Lamination - X-RAY & Rounting - Copper reduce & brown oxide - Laser Drilling - Drilling - Desmear PTH - Panel plating - Outer Layer dry film - Etching - AOI- Impedance Testing - S/M Pluged hole - Solder Mask - Component Mark - Impedance testing - Immersion Gold -V-cut - Routing - Electrical Test - FQC - FQA -Package -Shipment


    Buried Vias Enig Oem Pcb Board Multi-Layering 1oz Hdi


    Similar products


    Buried Vias Enig Oem Pcb Board Multi-Layering 1oz Hdi

    Buried Vias Enig Oem Pcb Board Multi-Layering 1oz Hdi


    HDI PCB Board Application Field


    Our PCB are widely used in communication equipment, industrial control, consumer electronics, medical equipment, aerospace, light-emitting diode lighting, automotive electronics etc.


    Workshop


    Buried Vias Enig Oem Pcb Board Multi-Layering 1oz Hdi


    Buried Vias Enig Oem Pcb Board Multi-Layering 1oz Hdi


    Common packaging


    1.PCB: Vacuum packaging with carton box
    2.PCBA: ESD packaging with carton box



    Our advantage


    1.Service value

    Independent quotation system to quickly serve the market

    2.PCB manufacturing

    High-tech PCB and PCB assembly production line

    3.Material purchasing

    A team of experienced electronic component procurement engineers

    4.SMT post soldering

    Dust-free workshop, high-end SMT patch processing


    Buried Vias Enig Oem Pcb Board Multi-Layering 1oz Hdi

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