Multiple layer FR4 HASL Lead Free SMD DIP Printed Circuit Board PCB
SMT Assembly
PCB SMT Assembly Introduction
Beijing Haina Lean has professional component procurement team,
centralized procurement, and save your procurement costs, labor
costs, quality costs. We offer competitive pricing, high quality products, as well as
flexible shipment plans to you.
Our engineers is qualified and experienced in producing
surface-mount (SMT), through-hole (THT) and mixed-technology
components and fine-pitch parts and ball grid arrays (BGAs) for
high-density FR-4 PCBs .
PCBA CAPABILITIES
| Layers | 1 - 36 L |
| Substrate | FR-4,CTI600,Tg180,,Anti CAF,Halogen-free,,High
frequency,Tg170&HF |
| Max. panel size | 700x610mm |
| Board thickness | 0.3 mm - 3.5 mm. |
| Copper thickness | 1/3 oz. to 6 oz. (outer) (Max) |
| Hole | > 0.15mm. |
| Aspect Ratio | 10 : 1 |
| Min. track width | 3.0 mils(partial) |
| Min. track space | 3.0mils(partial) |
| Min. S/M bridge | 3mil |
| Hole plugging diameter | 0.3 mm~0.55 mm. |
| Impedance tolerance | +/- 10%. |
| Color of S/M | green,white,black,red,orange,yellow,blue,purple |
| Surface treatment | OSP,HAL,HAL LF,ENIG,Hard gold,Imm Ag,Imm Sn,Peelable
soldermask,Carbon ink print,Selective hard gold |
Our SMT capabilities:
SMT Assembly: SMT provides a flexible high technology. These
solutions include:
7 high-speed placement machines,
7 automatic printers with fiducial alignment,
2 X-ray machines,
BGA maintenance machines,
ICT test machines
Our DIP function:
A-8 semi-assembly production line with four wave soldering machines
1 U-shaped automatic assembly line for box-type building products
with test stations
High temperature / low temperature aging test furnace B-4 for
products required for aging test
With time control and temperature control
All products are 100% inspected and tested during the DIP process
Haina lean Electronics Co.,Ltd is a competitive China customize
pcba for medical breathing machine OEM manufacturer, supplier and
vendor, you can get quick turn customize pcba for medical breathing
machine production prototypes and samples from our factory.
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PCB SMT Assembly Process
1.Solder Paste stenciling---2.Surface Mount Technology (Pick and
Place)---3.Reflow Soldering---4.Inspection and Quality
Control---5.Through-Hole Component Insertion (DIP
Process)---6.Final Inspection and Functional Test
Our advantage
1.Service value
Independent quotation system to quickly serve the market
2.PCB manufacturing
High-tech PCB and PCB assembly production line
3.Material purchasing
A team of experienced electronic component procurement engineers
4.SMT post soldering
Dust-free workshop, high-end SMT patch processing
PCB SMT Assembly Delivery Time
| Product Type | Qty | Normal lead time | Quick-turn lead time |
| SMT+DIP | 1-50 | 1WD-2WD | 8H |
| SMT+DIP | 51-200 | 2WD-3WD | 1.5WD |
| SMT+DIP | 201-2000 | 3WD-4WD | 2WD |
| SMT+DIP | ≥2001 | 4WD-5WD | 3WD |
| PCBA(2-4Layer) | 1-50 | 2.5WD-3.5WD | 1WD |
| PCBA(2-4Layer) | 51-2000 | 5WD-6WD | 2.5WD |
| PCBA(2-4Layer) | ≥2001 | ≥7WD | 5WD |
| PCBA(6-10Layer) | 1-50 | 3WD-4WD | 2.5WD |
| PCBA(6-10Layer) | 51-2000 | 7WD-8WD | 6WD |
| PCBA(10-HDILayer) | 1-50 | 7WD-9WD | 5WD |
| PCBA(10-HDILayer) | 51-2000 | 9WD-11WD | 7WD |
Electronic Board Assembly Application Field
Our products are widely used in communication equipment, industrial
control, consumer electronics, medical equipment, aerospace,
light-emitting diode lighting, automotive electronics etc.
Workshop
Common packaging
1.PCB: Vacuum packaging with carton box
2.PCBA: ESD packaging with carton box
